ArrowArtboardCreated with Sketch.Title ChevronTitle ChevronIcon FacebookIcon LinkedinIcon Mail ContactPath LayerIcon MailPositive ArrowIcon Print

TSMC to invest record $20bn in advanced 3-nm chips

Nanjing facility to begin work ahead of schedule on robust Chinese demand

TSMC’s Co-Chief Executive Mark Liu, right, presents an award to Gary Dickerson, CEO of Applied Materials, on Dec. 7. (Photo by Cheng Ting-Fang)

HSINGCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co., the world's biggest contract chipmaker by revenue, is planning to spend more than $20 billion to build the world's most advanced 3-nanometer chip facility in Taiwan in the early 2020s, according to a senior company executive.

It will be the largest investment the Taiwanese chipmaker has ever made and highlights TSMC's relentless efforts to stay ahead of competitors including South Korea's Samsung Electronics and U.S. tech group Intel.

Sponsored Content

About Sponsored Content This content was commissioned by Nikkei's Global Business Bureau.

Nikkei Asian Review, now known as Nikkei Asia, will be the voice of the Asian Century.

Celebrate our next chapter
Free access for everyone - Sep. 30

Find out more