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TSMC to invest record $20bn in advanced 3-nm chips

Nanjing facility to begin work ahead of schedule on robust Chinese demand

TSMC’s Co-Chief Executive Mark Liu, right, presents an award to Gary Dickerson, CEO of Applied Materials, on Dec. 7. (Photo by Cheng Ting-Fang)

HSINGCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co., the world's biggest contract chipmaker by revenue, is planning to spend more than $20 billion to build the world's most advanced 3-nanometer chip facility in Taiwan in the early 2020s, according to a senior company executive.

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