ArrowArtboardCreated with Sketch.Title ChevronTitle ChevronIcon FacebookIcon LinkedinIcon Mail ContactPath LayerIcon MailPositive ArrowIcon Print
China debt crunch

Chinese chipmaker Tsinghua Unigroup faces Thursday bond deadline

Concern among investors rises after company warns of payment risks

Tsinghua Unigroup is majority owned by Beijing science and engineering school Tsinghua University, the alma mater of Chinese President Xi Jinping.   © Reuters

HONG KONG -- Tsinghua Unigroup, a technology conglomerate under the umbrella of prominent Beijing science and engineering school Tsinghua University, has warned investors that it could miss another bond payment.

The chipmaker, which already defaulted on an onshore bond last month, is now sending signals to investors holding a $450 million Eurobond and a 5 billion yuan ($765 million) domestic bond for which payments come due Thursday.

Sponsored Content

About Sponsored Content This content was commissioned by Nikkei's Global Business Bureau.

Discover the all new Nikkei Asia app

  • Take your reading anywhere with offline reading functions
  • Never miss a story with breaking news alerts
  • Customize your reading experience

Nikkei Asian Review, now known as Nikkei Asia, will be the voice of the Asian Century.

Celebrate our next chapter
Free access for everyone - Sep. 30

Find out more