Chinese chipmaker Tsinghua Unigroup faces Thursday bond deadline

Concern among investors rises after company warns of payment risks

20201209 Tsinghua Unigroup

Tsinghua Unigroup is majority owned by Beijing science and engineering school Tsinghua University, the alma mater of Chinese President Xi Jinping. © Reuters

KENJI KAWASE, Nikkei Asia chief business news correspondent

HONG KONG -- Tsinghua Unigroup, a technology conglomerate under the umbrella of prominent Beijing science and engineering school Tsinghua University, has warned investors that it could miss another bond payment.

The chipmaker, which already defaulted on an onshore bond last month, is now sending signals to investors holding a $450 million Eurobond and a 5 billion yuan ($765 million) domestic bond for which payments come due Thursday.

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