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TSMC to spend $20bn on 3-nanometer chips

World's biggest contract chip maker stretches the limit of manufacturing precision

TSMC’s Co-Chief Executive Mark Liu, right, presents an award to Gary Dickerson, CEO of Applied Materials, on Dec. 7. (Photo by Cheng Ting-Fang)

HSINCHU, TaiwanTaiwan Semiconductor Manufacturing Co. is planning to spend more than $20 billion to build the world's most advanced 3-nanometer chip facility, in Taiwan in the early 2020s, according to a senior company executive.

It will be the largest investment the Taiwanese chipmaker has ever made and highlights efforts by TSMC, which is the world's biggest contract chipmaker by revenue, to stay ahead of competitors including South Korea's Samsung Electronics and U.S. tech group Intel.

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