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Semiconductors

Canon to build $345m plant for chipmaking equipment in Japan

Company to develop next-generation lithography devices

Canon plans to spend $345 million to build a new plant to produce semiconductor lithography equipment by the spring of 2025. (Source photo by AP) 

TOKYO -- Canon will build a new semiconductor equipment plant in eastern Japan, Nikkei has learned, as the company mirrors big investments by chipmakers in the U.S., South Korea and Taiwan.

The new plant will be built in Tochigi prefecture and begin operating in the spring of 2025. The investment will total more than 50 billion yen ($345 million), including construction costs and installation of production equipment. The company aims to double its current capacity.

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