TAIPEI/BEIJING -- China's leading chip and display companies are making strides in advanced packaging technologies, in a boost for the country's AI ambitions despite an intensifying U.S. clampdown.
Tongfu Microelectronics has started sample production of high-bandwidth memory (HBM), a critical component in AI computing, while display heavyweight BOE Technology is set to begin trial production of a new type of chip substrate for use in cutting-edge chip packaging processes.
.jpg?width=178&fit=cover&gravity=faces&dpr=2&quality=medium&source=nar-cms&format=auto&height=100)
