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Intel, TSMC and Samsung join forces on chip stacking technology

New consortium aims to set global standard for industry's next frontier

The new consortium aims to establish a single chip packaging standard, dubbed Universal Chiplet Interconnect Express (UCIe), to create a new ecosystem on better ways of combining "chiplets" to create a more powerful chip system. (Source photos by AP and Getty Images)

TAIPEI -- Intel, Taiwan Semiconductor Manufacturing Co. and Samsung will work together to establish an industry standard for advanced chip-packaging technologies, the next key battleground in the race to build more powerful electronics devices.

The world's three biggest chipmakers, along with several other leading tech companies, announced on Thursday that they will form a consortium for collaboration on next-generation chip packaging and stacking, the last steps in semiconductor manufacturing before chips are mounted onto print circuit boards and assembled into electronic devices.

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