Japan plans bonds backed by NTT stake to aid Rapidus

Government to tap shareholdings to avoid taxpayer burden for chip industry support

20241101N rapidus plant under construction

Japan's Rapidus estimates that it will need more than $30 billion to reach its goal of mass-producing cutting-edge chips by 2027. (Photo by Hajime Tsukada)

KOSUKE TAKEUCHI, MARI ISHIBASHI and YOHEI HIROSE, Nikkei staff writers

TOKYO -- The Japanese government has created a plan to financially support the country's semiconductor industry, leveraging such assets as its stake in NTT to pay for a program set to last several years, Nikkei has learned.

Rather than just subsidies, the framework involves a multistage approach. Semiconductor device manufacturers will receive subsidies while they are still working toward mass production. Then, once they reach that milestone, the government will switch to such other forms of support as investment and guarantees for private-sector financing, continuing until around 2030.

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