TAIPEI -- Top global chipmaker Taiwan Semiconductor Manufacturing Co. and Arizona-headquartered Amkor have agreed to work together on advanced chip packaging on U.S. soil, marking a victory in American efforts to bring critical chip supply chain technology onshore.
TSMC and Amkor, the world's No. 2 chip packaging and testing service provider, announced their memorandum of understanding on Friday. This will be the first time to establish such production -- all of which is currently concentrated in Taiwan -- in the U.S. The deal will expand the U.S. semiconductor ecosystem and accelerate product cycle times, the joint statement said.
