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TSMC considering first chip packaging plant in US

Facility to handle increasingly important step in semiconductor manufacturing

Taiwan Semiconductor Manufacturing Co. is considering further expanding its chip production capacity in the U.S.   © Reuters

TAIPEI --Taiwan Semiconductor Manufacturing Co. is considering building another advanced plant in the U.S., Nikkei Asia has learned, as the world's biggest contract semiconductor supplier responds to Washington's desire to bring more of the tech supply chain onto home turf.

The new plant would carry out chip packaging, using advanced technology to integrate different types of semiconductors onto wafers. Innovation in packaging chips is emerging as an industry battleground for TSMC and rivals including Intel and Samsung, and this would be TSMC's first such facility outside Taiwan.

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