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TSMC considering first chip packaging plant in US

Facility to handle increasingly important step in semiconductor manufacturing

Taiwan Semiconductor Manufacturing Co. is considering further expanding its chip production capacity in the U.S.   © Reuters

TAIPEI --Taiwan Semiconductor Manufacturing Co. is considering building another advanced plant in the U.S., Nikkei Asia has learned, as the world's biggest contract semiconductor supplier responds to Washington's desire to bring more of the tech supply chain onto home turf.

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