PENANG, Malaysia -- Top chip packaging provider ASE Technology Holding is investing $200 million to trial next-generation chip packaging technology built on square substrates, rather than traditional round wafers, in an attempt to boost AI computing performance.
CEO Tien Wu told reporters that his team is working with suppliers to build a test production line this year at its most important research and development hub in Kaohsiung, Taiwan, and to prepare samples for customers by next year. The $200 million initial investment covers only the purchase of machines for an initial small-scale production line and does not include total R&D spending.
