WASHINGTON (Reuters) -- The U.S. Commerce Department on Thursday finalized an award to SK Hynix of up to $458 million in government grants to help fund an advanced chip packaging plant and research and development facility for artificial intelligence products in Indiana.
In April, the Nvidia supplier said it would invest $3.87 billion to build the West Lafayette facility which will include an assembly line to mass produce next-generation high bandwidth memory chips. The chips are used in graphic processing units that train artificial intelligence systems.
