Intel aims to overtake Samsung in contract chipmaking. TSMC might help

US chip giant's turnaround plan hinges on 18A, advanced packaging and AI demand

20250514 Intel's CEO Lip-Bu Tan and Intel foundry

Intel's CEO Lip-Bu Tan speaks at the company's Annual Manufacturing Technology Conference in San Jose, California, U.S. on April 29.

YIFAN YU

PALO ALTO, California -- From the sudden departure of CEO Pat Gelsinger in December to layoffs and ever-changing U.S. tariff policies, Intel has had a tumultuous few months.

But the U.S. chip titan still wants to be the world's No. 2 foundry company by 2030. That would mean beating out Samsung Electronics, currently the second-largest maker of chips for others, and carving out a market for itself even as Taiwan Semiconductor Manufacturing Co. (TSMC) tightens its grip on the leading position amid rising AI chip demand.

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