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TSMC and Google push chipmaking boundaries with 3D 'stacking'

Taiwanese chip titan testing new production tech to boost computing power

TSMC is drawing attention to the growing importance of chip packaging, a little-known part of the process of making semiconductors.   © AFP/Jiji

TAIPEI -- Taiwan Semiconductor Manufacturing Co. is working with Google and other U.S. tech giants to develop a new way of making semiconductors more powerful.

The industry's traditional approach of cramming ever more transistors onto a single chip is starting to lose steam. In response, the world's largest contract chipmaker is focusing on chip packaging -- a little-known part of the process of making semiconductors but one that is becoming an industry battleground.

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