ArrowArtboardCreated with Sketch.Title ChevronTitle ChevronIcon FacebookIcon LinkedinIcon Mail ContactPath LayerIcon MailPositive ArrowIcon Print
Technology

TSMC and Google push chipmaking boundaries with 3D 'stacking'

Taiwanese chip titan testing new production tech to boost computing power

TSMC is drawing attention to the growing importance of chip packaging, a little-known part of the process of making semiconductors.   © AFP/Jiji

TAIPEI -- Taiwan Semiconductor Manufacturing Co. is working with Google and other U.S. tech giants to develop a new way of making semiconductors more powerful.

The industry's traditional approach of cramming ever more transistors onto a single chip is starting to lose steam. In response, the world's largest contract chipmaker is focusing on chip packaging -- a little-known part of the process of making semiconductors but one that is becoming an industry battleground.

Sponsored Content

About Sponsored Content This content was commissioned by Nikkei's Global Business Bureau.

Discover the all new Nikkei Asia app

  • Take your reading anywhere with offline reading functions
  • Never miss a story with breaking news alerts
  • Customize your reading experience

Nikkei Asian Review, now known as Nikkei Asia, will be the voice of the Asian Century.

Celebrate our next chapter
Free access for everyone - Sep. 30

Find out more