Company aims to expand 3D multi-chip integration and packaging project
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Founded in August 2014, SJ Semiconductor offers a 12-inch wafer bumping and testing service, an advanced wafer-level processing technology that is key to semiconductor packaging. (Screenshot from SJ Semiconductor's website)
HONG KONG -- Chinese chipmaker SJ Semiconductor has raised nearly $340 million in a Series C extension round, according to a release.
The company signed the first batch of investment agreements to this effect on March 29. The latest extension round values the firm at $1.8 billion.
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