TAIPEI -- China's Huawei Technologies is aggressively ramping up its chip packaging capabilities to lessen the impact of a U.S. clampdown that has cut the company's access to vital semiconductor production technologies, sources briefed on the matter told Nikkei Asia.
Chip packaging refers to the final step in semiconductor manufacturing before they are mounted onto print circuit boards and assembled into electronic devices. Compared to the manufacture of chips themselves, less of the relevant technology is controlled by American companies. Washington has cut off Huawei's access to advanced U.S. chipmaking technologies since 2019, citing national security concerns.
