GUANGZHOU -- Huawei Technologies is looking to raise $1.5 billion to finance in-house development of parts and software as it expects the current restrictions on access to American supplies will remain in place for the long haul.
The telecommunications equipment maker plans to issue debt to Chinese lenders, according to Bloomberg, which reported the plan this week. This would mark the Chinese company's first major bond float since its inclusion on an American blacklist in May that bars U.S. companies from doing business with it.
