TOKYO -- The chip industry needs more international standards for back-end, or latter-stage, production processes to enable companies like Intel and Taiwan Semiconductor Manufacturing Co. to increase capacity more efficiently.
Semiconductors
Chip industry needs more unified packaging approach, SEMI says
Japan's Jim Hamajima says lack of shared standards is hindering capacity expansion
As the industry struggles to keep packing more power into smaller chips, equipment and materials suppliers would have an easier time coming up with unique solutions if the supply chain wasn't so "balkanized," the president of the Japan office of SEMI says. (Photo courtesy of SEMI Japan)
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