Intel breaks ground on $20bn Ohio chip plants as Biden touts win over China

Chipmaker faces uphill battle for foundry market share against TSMC and Samsung

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U.S. President Joe Biden attends the groundbreaking of the new Intel semiconductor manufacturing facility in Ohio. © Reuters

YIFAN YU, Nikkei staff writer

PALO ALTO, U.S. -- Intel broke ground Friday on a $20 billion chip production complex in Ohio, a month after the passage of U.S. incentives meant to help the semiconductor industry better compete at home against Asian rivals like Taiwan Semiconductor Manufacturing Co. and Samsung Electronics.

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