PENANG, Malaysia -- Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, as America's biggest chipmaker seeks to regain the global lead in semiconductor manufacturing.
Semiconductors
Intel to quadruple cutting-edge chip packaging capacity by 2025
Top U.S. chipmaker expanding heavily in Malaysia to meet growing global demand
Malaysia is already a vital chip packaging, assembly and testing base for Intel, which employs 15,000 staff in the country. (Photo by Cheng Ting-Fang)
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