TAIPEI -- Intel, Taiwan Semiconductor Manufacturing Co. and Samsung will work together to establish an industry standard for advanced chip-packaging technologies, the next key battleground in the race to build more powerful electronics devices.
Semiconductors
Intel, TSMC and Samsung join forces on chip stacking technology
New consortium aims to set global standard for industry's next frontier
The new consortium aims to establish a single chip packaging standard, dubbed Universal Chiplet Interconnect Express (UCIe), to create a new ecosystem on better ways of combining "chiplets" to create a more powerful chip system. (Source photos by AP and Getty Images)
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