TOKYO -- Toppan Holdings plans to build a semiconductor package substrate plant in Singapore and begin operations at the end of 2026, joining several other Japanese substrate makers in boosting capital investment amid booming demand tied to artificial intelligence.
Semiconductors
Japan's Toppan to build Singapore chip package substrate plant
AI demand spurs big capital investments from Japanese makers
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Toppan aims to bolster business continuity by setting up production in Singapore, away from its Japanese operations. (Toppan)
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