TOKYO -- From Nissan Chemical to Showa Denko, Japanese semiconductor materials makers are expanding output of products used in 3D chip packaging in response to chipmakers' growing interest.
Semiconductors
Nissan Chemical, rivals make inroads in 3D-chip packaging materials
Japanese players eye growing focus on back-end semiconductor production
A wafer is checked by a worker in the clean room at UTAC's plant in Singapore. © Reuters
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