TOKYO -- Canon and other Japanese chipmaking equipment suppliers are seeking inroads into technology used late in production, steps that semiconductor industry leaders like TSMC and Intel see as crucial to their competitiveness.
Japanese suppliers offer new tech for back end of semiconductor production

Chip packaging has come into focus as a vital part of chipmakers' competiveness. (Photo courtesy of Intel)
TOKYO -- Canon and other Japanese chipmaking equipment suppliers are seeking inroads into technology used late in production, steps that semiconductor industry leaders like TSMC and Intel see as crucial to their competitiveness.