Packaging, vital to performance for chipmakers, becomes new front for Canon

Japanese suppliers offer new tech for back end of semiconductor production

20221228N Intel chip

Chip packaging has come into focus as a vital part of chipmakers' competiveness. (Photo courtesy of Intel) 

RYOSUKE EGUCHI, NAMI MATSUURA and YUI USUI, Nikkei staff writers

TOKYO -- Canon and other Japanese chipmaking equipment suppliers are seeking inroads into technology used late in production, steps that semiconductor industry leaders like TSMC and Intel see as crucial to their competitiveness.

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