PENANG, Malaysia -- Top chip packaging provider ASE Technology Holding is investing $200 million to trial next-generation chip packaging technology built on square substrates, rather than traditional round wafers, in an attempt to boost AI computing performance.
Semiconductors
Taiwan's ASE to invest $200m in 'square' AI chip packaging tech
CEO aims to have samples by 2026 but lack of machines poses bottleneck
Leading chip packager ASE Technology is exploring cutting-edge packaging methods to further boost computing performance. (Photo by Cheng Ting-Fang)
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