Toshiba scraps power semiconductor cooperation with Chinese wafer maker

Economic security considerations seen behind decision to end technology pact

20251029N Toshiba sign

Toshiba's power semiconductor subsidiary will continue to source wafers from China's SICC even after ending a technical cooperation agreement. © Reuters

NEO JIMBO

TOKYO -- A Toshiba subsidiary has withdrawn from a recent technical cooperation agreement with a Chinese wafer supplier, Nikkei has learned, amid apparent economic security concerns over the deal.

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