TAIPEI -- Top global chipmaker Taiwan Semiconductor Manufacturing Co. and Arizona-headquartered Amkor have agreed to work together on advanced chip packaging on U.S. soil, marking a victory in American efforts to bring critical chip supply chain technology onshore.
Semiconductors
TSMC, Amkor to bring advanced chip packaging to U.S. for first time
Key for AI, deal marks milestone in American effort to build critical supply chain
Taiwan's TSMC will work with Amkor on advanced chip packaging on U.S. soil. (Source photos by Reuters)
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