TSMC breaks ground on first Europe chip fab with eye on auto sector

Chipmaker scrambles for staff in Dresden to avoid delays in overseas expansion

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Taiwan Semiconductor Manufacturing Co. aims to start up the fabrication facility in Dresden by 2027. © Reuters

HIDEAKI RYUGEN, Nikkei staff writer

TAIPEI -- Taiwan Semiconductor Manufacturing Co. on Tuesday broke ground on its first fabrication facility in Europe to provide a steady supply of automotive chips for one of the region's core industries.

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