SemiconductorsTSMC considering first chip packaging plant in US
Facility to handle increasingly important step in semiconductor manufacturing
Taiwan Semiconductor Manufacturing Co. is considering further expanding its chip production capacity in the U.S. © Reuters
CHENG TING-FANG and LAULY LI, Nikkei staff writers
TAIPEI --Taiwan Semiconductor Manufacturing Co. is considering building another advanced plant in the U.S., Nikkei Asia has learned, as the world's biggest contract semiconductor supplier responds to Washington's desire to bring more of the tech supply chain onto home turf.