HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co. is exploring a new method of advanced chip packing as the world's biggest chipmaker races to keep pace with the AI-fueled demand for computing power.
Semiconductors
TSMC explores radical new chip packaging approach to feed AI boom
Rectangular substrates to unlock more power are also being tested by Intel and Samsung
Big semiconductor makers are exploring new methods of chip packaging to place more chipset on each piece of substrate. (Photo by Cheng Ting-Fang)
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