SemiconductorsTSMC to invest $2.9bn in advanced packaging plant for AI chips
Taiwanese chipmaker sees segment sales rising 50% yearly
Construction on the new plant will begin in the second half of 2024, with mass production expected in 2027. © Reuters
HIDEAKI RYUGEN, Nikkei staff writer
TAIPEI -- Taiwan Semiconductor Manufacturing Co. will invest 90 billion New Taiwan dollars ($2.87 billion) to build a plant in western Taiwan that handles advanced packaging of high-performance semiconductors necessary for generative artificial intelligence.