TSMC to invest $2.9bn in advanced packaging plant for AI chips

Taiwanese chipmaker sees segment sales rising 50% yearly

20230725N TSMC

Construction on the new plant will begin in the second half of 2024, with mass production expected in 2027. © Reuters

HIDEAKI RYUGEN, Nikkei staff writer

TAIPEI -- Taiwan Semiconductor Manufacturing Co. will invest 90 billion New Taiwan dollars ($2.87 billion) to build a plant in western Taiwan that handles advanced packaging of high-performance semiconductors necessary for generative artificial intelligence.

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