TOKYO -- Japanese semiconductor material maker Resonac has established a consortium of nearly 30 global companies to develop advanced chip packaging technologies, as the industry looks for cost-effective ways to boost chip performance to meet surging AI demand.
Technology
Japan's Resonac sets up consortium on next-gen chip packaging tech
Move comes as AI drives demand for ever-greater computing power
Chip packaging, where multiple chips are integrated into a single module, is becoming increasingly important for boosting computing power. (Photo by Yuki Nakao)
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