AI chip packaging drives peak investment at Japan's Ibiden

Plants for expanded capacity slated to go into operation by 2026, CEO says

20241003N Ibiden chip packaging

Ibiden is the world's top supplier of advanced chip packaging substrates. (Ibiden)

AYAKA NAGANAWA, Nikkei staff writer

NAGOYA, Japan -- Japanese chip packaging supplier Ibiden has been busy expanding capacity to manufacture advanced products for the artificial intelligence market. The spending includes two factories in Gifu prefecture that are due to be up and running in the next few years.

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