TAIPEI -- China's Huawei Technologies is aggressively ramping up its chip packaging capabilities to lessen the impact of a U.S. clampdown that has cut the company's access to vital semiconductor production technologies, sources briefed on the matter told Nikkei Asia.
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Huawei is aggressively ramping up its chip packaging capabilities as a way to lessen the impact of U.S. restrictions on the company's access to vital semiconductor production technologies. (Source photo by AP and Reuters)
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